Potting Process
We encapsulate electronic assemblies in metal or plastic enclosures using two-component resins with two potting systems . Typically, polyurethane compounds are used to securely embed the assemblies within the housing, ensuring protection against moisture, vibrations, forces, torque, and heat . Additionally, the electrically insulating potting compound efficiently transfers generated heat from the electronics to the enclosure. This method is particularly advantageous for durable and robust applications .
Hotmelt Molding Process
For hotmelt molding , we use metal molds and a production system for processing thermoplastics . The assembled PCBs are placed in the lower mold , and after lowering the upper mold, the cavity is filled with thermoplastic material . Process expertise is critical to ensuring the quality of the plastic encapsulation . This method is particularly effective for selectively protecting small areas of the assembly .
Differences Between Potting and Hotmelt Molding
The two processes differ in processing temperatures and investment costs . Hotmelt molding requires an injection molding tool and heats PCBs and components up to 200°C for a few seconds . In contrast, potting with polyurethane-based reactive resins occurs at around 35°C , with a negative mold only required if certain areas need to remain uncovered .