We encapsulate and overmold components using potting and hotmelt molding processes, providing protection against harsh environmental conditions such as moisture, vibrations, dust, heat, and mechanical stress.

Potting Process

We encapsulate electronic assemblies in metal or plastic enclosures using two-component resins with two potting systems. Typically, polyurethane compounds are used to securely embed the assemblies within the housing, ensuring protection against moisture, vibrations, forces, torque, and heat. Additionally, the electrically insulating potting compound efficiently transfers generated heat from the electronics to the enclosure. This method is particularly advantageous for durable and robust applications.

Hotmelt Molding Process

For hotmelt molding, we use metal molds and a production system for processing thermoplastics. The assembled PCBs are placed in the lower mold, and after lowering the upper mold, the cavity is filled with thermoplastic material. Process expertise is critical to ensuring the quality of the plastic encapsulation. This method is particularly effective for selectively protecting small areas of the assembly.

Differences Between Potting and Hotmelt Molding

The two processes differ in processing temperatures and investment costs. Hotmelt molding requires an injection molding tool and heats PCBs and components up to 200°C for a few seconds. In contrast, potting with polyurethane-based reactive resins occurs at around 35°C, with a negative mold only required if certain areas need to remain uncovered.