The core technology in modern electronics manufacturing.

Reliable, flexible & fast.

In Surface-Mount Technology (SMT), electronic components are precisely placed on PCBs using our CNC-controlled Siplace pick-and-place machines. The placement positions are defined by assembly plans. The linear-driven placement machines pick up the components from magazines using vacuum pipettes and position them with high speed and precision within milliseconds at their designated PCB locations. When placed, the metallic terminals of the components dip into the fine-grain solder paste, securing them for further processing.

The assembled PCBs then pass through our ERSA reflow ovens, where the solder paste melts in a nitrogen atmosphere, forming permanent, high-quality solder joints between the components and the PCB traces.

Advantages of SMT over Through-Hole Technology (THT):

• Compact & Lightweight: SMT components are generally smaller than THT counterparts, allowing for higher component density on PCBs. Their compact design increases packing and power density, reducing PCB size.

• High Mechanical & Electrical Stability: The surface mounting of SMT components creates robust electrical and mechanical connections. These can be fully inspected using Automated Optical Inspection (AOI). Due to their low mass, SMT components withstand vibrations and temperature fluctuations better than THT components.

• Improved Electrical Performance: SMT components have lower parasitic inductance and capacitance, making them ideal for high-frequency applications. This has enabled the cost-effective production of powerful and energy-efficient electronic assemblies with memory and processors.

• Automated & Cost-Efficient Manufacturing: SMT allows for fully automated assembly, reducing labor costs and increasing production speed while maintaining consistent quality.

Limitations of SMT:

For high-current applications, SMT components are less cost-effective than THT alternatives. Safety capacitors or common-mode chokes often rely on THT components, leading to a preferred hybrid assembly combining both SMT and THT technologies.