The core technology in modern electronics manufacturing.
Reliable, flexible & fast.
In Surface-Mount Technology (SMT) , electronic components are precisely placed on PCBs using our CNC-controlled Siplace pick-and-place machines . The placement positions are defined by assembly plans . The linear-driven placement machines pick up the components from magazines using vacuum pipettes and position them with high speed and precision within milliseconds at their designated PCB locations . When placed, the metallic terminals of the components dip into the fine-grain solder paste , securing them for further processing.
The assembled PCBs then pass through our ERSA reflow ovens , where the solder paste melts in a nitrogen atmosphere , forming permanent, high-quality solder joints between the components and the PCB traces.
Advantages of SMT over Through-Hole Technology (THT):
• Compact & Lightweight: SMT components are generally smaller than THT counterparts, allowing for higher component density on PCBs. Their compact design increases packing and power density , reducing PCB size.
• High Mechanical & Electrical Stability: The surface mounting of SMT components creates robust electrical and mechanical connections . These can be fully inspected using Automated Optical Inspection (AOI) . Due to their low mass , SMT components withstand vibrations and temperature fluctuations better than THT components.
• Improved Electrical Performance: SMT components have lower parasitic inductance and capacitance , making them ideal for high-frequency applications . This has enabled the cost-effective production of powerful and energy-efficient electronic assemblies with memory and processors .
• Automated & Cost-Efficient Manufacturing: SMT allows for fully automated assembly , reducing labor costs and increasing production speed while maintaining consistent quality .
Limitations of SMT:
For high-current applications , SMT components are less cost-effective than THT alternatives. Safety capacitors or common-mode chokes often rely on THT components , leading to a preferred hybrid assembly combining both SMT and THT technologies .