Automated Optical Inspection (AOI)
Automated Optical Inspection (AOI) is a testing and inspection method that we use extensively. It checks the position, placement, solder connections to the PCB, and labeling of components to ensure that the correct components are placed in the right positions. Our AOI systems use movable digital camera systems and various light sources to capture high-resolution images of SMT and THT components on PCBs. These images are then compared to predefined reference images to detect manufacturing defects such as missing or incorrect components, soldering issues, or short circuits between traces or connections. These defects are often undetectable with the naked eye during manual inspection. By using AOI, we significantly reduce error rates and enhance the reliability of our final products.
The inspection of assemblies is fully automated and takes less than three minutes, even for complex electronic assemblies with 1,000 components. These CNC-controlled machines have significantly increased production speed while greatly improving defect detection. Handling systems with automatic assembly storage also allow us to conduct unmanned inspections in a very short time.
AOI systems are used at various stages of the manufacturing process, including after SMT assembly, THT assembly, or as a final inspection after coating. AOI ensures compliance with quality standards and guarantees that the assembled boards meet the required specifications. In addition to defect detection, AOI provides detailed error analysis to identify the type and cause of technical issues. This helps with troubleshooting and improving both the manufacturing process and the final product.
X-Ray Inspection
With our X-ray inspection system, we examine electronic assemblies, including complex multilayer PCBs and 3D components, as part of our quality control process. X-ray technology is used to visualize the internal structures of solder joints, processors, and components with hidden solder connections without causing damage. This technique identifies solder bridges, PCB defects, and soldering issues such as cold joints, under- or over-soldering, as well as misplacements of LED, LGA, QFN, IGBT, QFN, and BGA components. Additionally, the internal structures of encapsulated or overmolded components can be examined non-destructively, enabling precise analysis of components and their connections. This allows us to enhance the quality of electronic assemblies by adjusting and modifying upstream manufacturing processes. X-ray inspection also provides detailed measurement results and enables direct feedback to the production process.
The quality and reliability of electronic products are improved through X-ray inspection. By continuously integrating it into the quality control loop, we reduce production costs and prevent follow-up expenses. Additionally, our customers appreciate the ability to conduct non-destructive analyses of technical faults.
Solder Paste Inspection (SPI)
After solder paste application, SPI automatically inspects the position of the solder paste on the pads. It measures and evaluates the distribution and thickness of the applied solder paste. This ensures that all necessary areas are covered with solder paste and correctly distributed on the PCB. Potential solder paste defects can be detected before assembly and corrected early on. By identifying issues such as missing solder paste or solder bridges at an early stage, SPI helps prevent subsequent errors in the production process. The SPI system operates fully automatically and enables immediate error correction.
