Electronic assemblies with high component density, double-sided mounting, or an SMT-THT component mix require enhanced creep resistance and corrosion protection, especially if they are exposed to dust or moisture during their lifecycle.

By implementing an environmentally friendly automated wet cleaning process using an energy-efficient recirculation system, we remove chemical residues from PCB manufacturing, fingerprints, flux, and adhesive residues. This extends the lifespan of the assemblies, prevents random failures caused by contamination, and ensures reliable downstream coating processes.