Our new 3D AOI system enables us to inspect electronic assemblies even faster and more precisely. Combined 2D/3D inspection, 360° angled-view cameras and the highest optical quality allow us to maximise defect detection in very small and complex components. The benefits for our customers: even higher quality standards, fewer false calls and improved defect detection. We use the system to monitor process stability and work towards perfect manufacturing results and consistently high-quality electronic assemblies.
The new reflow oven brings the highest soldering quality and energy-efficient reflow processes to our production operations. It ensures particularly stable temperature profiles, while the Smart Cleaning System significantly extends maintenance intervals and increases equipment availability. Our customers benefit from reliable, reproducible soldering results that are ideal for demanding electronic assemblies and tight component specifications.
Our new placement machine significantly increases our placement capacity. Combined with the existing machines, the platform provides more feeder positions and reduces assembly handling during production. This allows us to further expand high-mix, low-volume assembly manufacturing. With advanced placement head technology ranging from high-speed to highly flexible, we reduce setup times, speed up product changeovers and improve process reliability across a wide range of components. For our customers, this means shorter lead times, more precise component placement and greater planning certainty. Ideal for demanding electronics in small batches and prototypes.
We are particularly pleased that these investments are strengthening our technological capabilities. These additions are technical improvements that keep us up to date and demonstrate our commitment to meeting the varied requirements of our customers' current and future projects with a high degree of flexibility.